Topical Symposium 6
This session focuses on the design, deposition, characterization, modeling, and integration of thin films for semiconductor, optoelectronic, and flexible electronic devices. Topics include functional materials for transistors, integrated circuits, memory devices, sensors, photonic and optoelectronic components, flexible and wearable electronics, as well as advanced semiconductor manufacturing and packaging technologies. The session covers the relationships among deposition processes, composition, microstructure, defects, interfaces, and the resulting electrical, optical, mechanical, and thermal properties of thin films. The session also highlights novel characterization techniques, in situ and operando diagnostics, multiscale modeling, reliability and performance assessment, and industrial perspectives on thin-film technologies for next-generation semiconductor and electronic devices, bridging fundamental materials science with practical device applications.
TS6. Invited Speakers:
- Ying-Hao Chu, National Tsing Hua University, Taiwan, “van der Waals Epitaxy of Bi2O2Se for Advanced Semiconductor Devices”
- Shih-Nan Hsiao, Nagoya University, Japan
- Dong-Sing Wuu, National Chi Nan University, Taiwan
- Radek Žemlička, EVATEC AG, Switzerland, “HiPIMS with Synchronized RF Bias Combined with Complementary Directional Sputtering Strategies for Patterned Semiconductor Features”