Abstract Submission Deadline: October 30, 2026
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  • Overview
    • Introduction & Greetings
    • Program Committee
      • Symposium & Session Chairs
    • Code of Conduct (PDF)
    • Call for Awards Nominations
      • Protocol for Graduate Student Awards
      • Protocol for R.F. Bunshah Annual Award & ICMCTF Lecture
      • Protocol for the Bill Sproul Award and Honorary ICMCTF Lecture
    • Manuscripts
    • Photo Gallery
    • Promotional Tools
      • ICMCTF 2027 512 x 512 Banner (JPG)
      • ICMCTF 2027 1024 x 1024 Banner (JPG)
  • Program
    • Presentation Instructions
    • Special Events
      • Lecture Series: Plenary
      • Lecture Series: Exhibitors Keynote
    • Symposia
      • Symposium CM: Advanced Characterization, Modelling and Data Science for Coatings and Thin Films
      • Symposium IA: Surface Engineering – Applied Research and Industrial Applications
      • Symposium MA (Materials A): Protective Coatings and High-Temperature
      • Symposium MB (Materials B): Functional Thin Films and Surfaces
      • Symposium MC (Materials C): Tribology and Mechanics of Coatings and Surfaces
      • Symposium MD (Materials D): Surface Engineering of Biomaterials, Medical Devices, and Regenerative Materials
      • Symposium PP: Plasma and Vapor Deposition Processes
      • Symposium SSE: Sustainable Surface Engineering
      • TS1. Promoting Women in Surface Engineering
      • TS2. Memorial Session for Jindřich Musil
      • TS3. Memorial Session for Steven Muhl
      • TS4. Honorary Session for Christian Mitterer
      • TS5. Honorary Session for Jia-Hong Huang: Mechanical Behavior of Transition Metal Nitride Coatings
      • TS6. Thin Films in Semiconductor, Optoelectronic, and Flexible Devices
  • Abstract Submission
    • Call for Abstracts (PDF)
    • Copyright Agreement (PDF)
    • Submission Guidelines
  • Exhibit
  • Housing & Travel
    • Hotel Map
    • Reserve Hotel
    • International Visitor Information
    • International Visitor FAQ
    • Things to Do
  • Sponsors
    • General Sponsors

Protocol for R.F. Bunshah Annual Award & ICMCTF Lecture

Purpose

The R.F. Bunshah Award and Honorary ICMCTF Lectureship is intended to recognize outstanding research or technological innovation in the areas of interest to the Advanced Surface Engineering Division (ASED) of the AVS, with an emphasis in the fields of surface engineering, thin films, and related topics.

Eligibility

The nominee shall have made pioneering contributions to the science or technology of surface engineering, thin films, or related fields of interest to ASED. The Award shall be granted without further restriction, except that the current ICMCTF General and Program Chairs and current members of the ASED Executive and Awards Committees are not eligible.

Nomination Procedure

A nomination may be made by anyone qualified to evaluate, highlight, and validate the nominee’s accomplishments. Any individual may submit one nominating or seconding letter for the award in any given year. The nomination packages MUST include the following.

Nomination Letter: The letter nominating an individual for an award must describe the work for which the award is proposed and indicate the role the work has played in solving particular scientific or technological problems. The significance of these problems and the impact of the nominee’s accomplishments in the field should be discussed. If the work was performed in collaboration with others, the contributions of the nominee should be clearly stated. The contribution of the nominee to the ICMCTF community should be included. A proposed citation, a one-sentence synopsis of the reason for selecting the nominee, and a list of individuals sending supporting letters must also be included. The nominating letter should not exceed two pages in length but should be as detailed as possible to allow the Award Committee to evaluate the nominee’s contributions.

Supporting Letters: A minimum of two and a maximum of five supporting letters must be arranged by the nominator. Typically, the letters should not exceed one page. Their main purpose is to endorse the nomination and to provide additional evidence of the nominee’s accomplishments. The supporting letters should be written by individuals at institutions other than that of the nominee.

Description of Research Highlights: A two-page summary of research accomplishments, citing key papers and patents, must be included. The purpose of the material is to document the scope of a nominee’s technical career, placing in context the specific work being nominated for the award.

Biographical Materials: A Curriculum Vitae or biographical sketch of the nominee and a list of publications and patents must be submitted.

Nominations remain active for three years.

Nature of the Award

The award consists of a commemorative plaque stating the nature of the award and an honorary lectureship at the ICMCTF conference at which the award is presented. This award is conferred annually, subject to the availability of suitable candidates. The award recipient shall receive complimentary meeting registration, travel expenses up to $1500, and up to six nights’ lodging at the conference hotel for the meeting at which the award is presented.

Nomination Submission and Deadline

All nomination materials must be compiled by the nominator and submitted as one package. The complete nomination package is to be sent electronically to the current Chair of the ASED Awards Committee (asedawards@avs.org) such that it is received by October 30, 2026. Late or incomplete application packages will not be evaluated.

André Anders
Plasma Engineering, LLC
asedawards@avs.org

Learn More

2026 R.F. Bunshah Award Recipient
Andrey Voevodin
University of North Texas

Previous Laureates of the R.F. Bunshah Award

  • 2025 –  Ludvik Martinu, Polytechnique Montréal, Québec, Canada
  • 2024 – Yip-Wah Chung, Northwestern University, Evanston, USA
  • 2023 – Lars Hultman, Linköping University, Sweden
  • 2022 – Jolanta E. Klemberg-Sapieha, Polytechnique Montréal, Québec, Canada
  • 2021 – André Anders, Leibniz Institute of Surface Engineering (IOM), Leipzig, Germany, and Felix Bloch Institute, Leipzig University, Leipzig, Germany
  • 2020 – Christian Mitterer, Department of Materials Science, Montanuniversität Leoben, Austria
  • 2019 – Joe Greene, University of Illinois, USA, Linköping University, Sweden, National Taiwan Univ. Science & Technology, Taiwan.
  • 2018 – Allan Matthews, University of Manchester, UK
  • 2017 – John A. Woollam, University of Nebraska, Lincoln NE, USA & J.A. Woollam Co.
  • 2016 – Boris A. Movchan, National Academy Sciences of Ukraine
  • 2015 – Péter B. Barna, Hungarian Academy of Sciences, Hungary
  • 2014 – Jindrich Musil, University of West Bohemia, Plzeň, Czech Republic
  • 2013 – William D. Sproul, Reactive Sputtering, Inc, USA
  • 2012 – Sture Hogmark, Uppsala University, Sweden
  • 2011- Stan Veprek, Technical University, Munich, Germany
  • 2010- Helmut Holleck, Karlsruhe Institute of Technology, Germany
  • 2009- Ivan Petrov, University of Illinois, USA
  • 2008- Steve Rossnagel, IBM, USA
  • 2007- Wolf-Dieter Munz, Sheffield Hallam University, UK

Key Dates

Call for Abstracts Deadline:
October 30, 2026

Awards Nomination Deadline:
October 30, 2026

Author Notifications:
December 14 , 2026

Early Registration & Housing  Deadline:
March 1, 2027

Manuscript Deadline:
July 31, 2027

Downloads

  • Code of Conduct (PDF)
  • Call for Abstracts (PDF)
  • Copyright Agreement (PDF)

Contact

CONFERENCE MANAGEMENT
Yvonne Towse

Conference Administrator

Della Miller 
Conference Manager
icmctf@icmctf.org

EXHIBITS
Ryan Foley and Bob Jonas
exhibits@avs.org

 

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