Abstract Submission Deadline: October 30, 2026
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Defects in Thin Films and Materials (T3)- 4/20/26

Monday, April 20, 8:00 a.m.-10:05 a.m.

Summary

This module introduces the role of defects in thin films and their influence on mechanical, thermal, electrical, and barrier-related properties. We discuss how point, line, and planar defects form during deposition, how they interact, and how they can be deliberately engineered through composition, stress, and architecture (e.g., multilayers, nanolamellae, amorphous/crystalline designs). The module highlights strategies for exploiting defect structures—including vacancy ordering, interface engineering, and multilayer architectures—to enhance hardness, toughness, transport properties, diffusion resistance, and long-term performance. Recent examples from our research on hydrogen permeation barriers and functional thin films such as thermoelectric Heusler materials illustrate how defect-controlled design can tailor mechanical, physical, and transport behavior.

Topics

  • Types of defects in thin films: point, line, and planar
  • Defect formation during PVD growth
  • Influence of defects on mechanical, thermal, electrical, and barrier properties
  • Point-defect engineering: vacancies, antisites, superstructures
  • Dislocations in thin films: generation, motion, interaction with stress
  • Grain boundaries, stacking faults, twins, and interfaces
  • Defect engineering strategies: multilayers, graded films, metastable and amorphous/crystalline architectures
  • Case studies from nitrides, carbides, high-entropy coatings, hydrogen barriers, and functional thin films (e.g., thermoelectrics)

Instructor

Paul Mayrhofer

University Professor of Materials Science
Head – Materials Science (E308-01)
Dean of Academic Affairs – Materials Science,
Mechanical Engineering, and ME–Management

Institute of Materials Science and Technology, TU Wien, Austria

Advance Registration Recommended!

Cost Per Track: $300
Cost Per Module: $100

Module(s) Include: Link to Course Notes (PDF)

You may select any combination of modules during the registration process

REGISTER

Key Dates

Call for Abstracts Deadline:
October 30, 2026

Awards Nomination Deadline:
October 30, 2026

Author Notifications:
December 14 , 2026

Early Registration & Housing  Deadline:
March 1, 2027

Manuscript Deadline:
July 31, 2027

Downloads

  • Code of Conduct (PDF)
  • Call for Abstracts (PDF)
  • Copyright Agreement (PDF)

Contact

CONFERENCE MANAGEMENT
Yvonne Towse

Conference Administrator

Della Miller 
Conference Manager
icmctf@icmctf.org

EXHIBITS
Ryan Foley and Bob Jonas
exhibits@avs.org

 

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